doc. no : qw0905-la236b/se rev : a date : 15 - aug. - 2005 data sheet ligitek electronics co.,ltd. property of ligitek only led array la236b/se
note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. lse2340-1 part no. la236b/se page 1/4 package dimensions ligitek electronics co.,ltd. property of ligitek only 25.0min 2.54typ 1.0min +- ?? 0.5typ 3.0 5.0 1.5max -+ 3.85? 0.5 6.0 2.9+0.5 -0.0 3.2 2.54typ 2.5 ?? 0.5typ 3.0? 0.5 3.0 4.5 5.0
note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. orange diffused typical electrical & optical characteristics (ta=25 j ) tstg gaasp/gap la236b/se orange emitted lens material part no color soldering temperature storage temperature tsol part no. la236b/se forward current i f power dissipation peak forward current duty 1/10@10khz reverse current @5v operating temperature t opr ir pd i fp absolute maximum ratings at ta=25 j parameter symbol peak wave length f pnm 1.7 min. 45 610 2.6 6.0 3.0 min. max. typ. 80 viewing angle 2 c 1/2 (deg) forward voltage @20ma(v) spectral halfwidth ??f nm luminous intensity @10ma(mcd) max 260 j for 5 sec max (2mm from body) -40 ~ +100 j page 2/4 20 ma -40 ~ +85 10 80 80 j g a ma mw absolute maximum ratings se unit ligitek electronics co.,ltd. property of ligitek only
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( j ) relative intensity@20ma wavelength (nm) forward voltage@20ma normalize @25 j fig.4 relative intensity vs. temperature ambient temperature( j ) relative intensity@20ma normalize @25 j typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) forward current(ma) fig.2 relative intensity vs. forward current relative intensity normalize @20ma ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 550 600 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 700 750 se chip part no. la236b/se page3/4
mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 solder resistance test 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. solderability test 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec this test intended to see soldering well performed or not. 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles thermal shock test high temperature high humidity test 1.ta=65 j? 5 j 2.rh=90 %~95% 3.t=240hrs ? 2hrs the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hous. part no. la236b/se page4/4 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) high temperature storage test low temperature storage test operating life test the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. test condition reliability test: test item description reference standard ligitek electronics co.,ltd. property of ligitek only
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